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- Condiciones seleccionadas:
Descubre los productos 112,204
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Advanced Thermal Solutions Inc. |
693
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 17MM X 17MM X 9.5MM
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- | Top Mount | Aluminum | Square, Fins | 0.669" (17.00mm) | 0.669" (17.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 28.00°C/W @ 200 LFM | - | Black Anodized | |||
|
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Advanced Thermal Solutions Inc. |
1,953
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 9.5MM
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- | Top Mount | Aluminum | Square, Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 15.30°C/W @ 200 LFM | - | Black Anodized | |||
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|
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CTS Thermal Management Products |
4,900
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
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APF | Top Mount | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 4.00°C/W @ 200 LFM | - | Black Anodized | ||
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Ohmite |
1,708
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3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-247 TO-264
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C40 | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.283" (58.00mm) | 1.724" (43.79mm) | - | Clip and Board Mounts | TO-247, TO-264, SOT-227 | 1.260" (32.00mm) | - | - | - | Degreased | ||
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|
Advanced Thermal Solutions Inc. |
975
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 7.5MM
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maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 0.590" (14.99mm) | 0.590" (14.99mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.295" (7.50mm) | - | 19.70°C/W @ 200 LFM | - | Blue Anodized | |||
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|
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CTS Thermal Management Products |
3,861
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 7.10°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
1,900
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 5.30°C/W @ 200 LFM | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
1,806
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK PIN-FIN W/TAPE
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- | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
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|
Advanced Thermal Solutions Inc. |
222
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 7.5MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.295" (7.50mm) | - | 8.60°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
|
CTS Thermal Management Products |
3,956
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 2.50°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
475
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 4.40°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
1,155
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 40X40X23MM PIN
|
910 | Top Mount | Aluminum | Square, Pin Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Clip | BGA | 0.892" (22.65mm) | - | 2.00°C/W @ 200 LFM | 8.30°C/W | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
231
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 19.5MM
|
- | Top Mount | Aluminum | Square, Fins | 0.590" (14.99mm) | 0.590" (14.99mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | - | 13.40°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
1,137
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 37.5 X 37.5 X 7.5MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.476" (37.50mm) | 1.476" (37.50mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.295" (7.50mm) | - | 4.90°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
|
CTS Thermal Management Products |
199
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 3.30°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
969
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 2.50°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
657
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 3.30°C/W @ 200 LFM | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
1,318
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 24.5MM
|
- | Top Mount | Aluminum | Square, Fins | 0.590" (14.99mm) | 0.590" (14.99mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | - | 10.50°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
3,361
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25.4MM X 25.4MM X 4MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | Thermal Tape, Adhesive (Included) | ASIC | 0.157" (4.00mm) | - | 9.00°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
712
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 17.5MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 0.590" (14.99mm) | 0.590" (14.99mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.689" (17.50mm) | - | 8.70°C/W @ 200 LFM | - | Blue Anodized |
