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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
3,766
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 2.5W BLK W/PINS
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- | 2.000" (50.80mm) | 0.640" (16.26mm) | Bolt On and PC Pin | 0.640" (16.26mm) | 1.5W @ 20°C | 4.00°C/W @ 300 LFM | ||
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Ohmite |
1,483
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK BLACK ANODIZED
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CSM | 1.102" (28.00mm) | 0.492" (12.50mm) | Solderable Feet | 1.228" (31.20mm) | 5.0W @ 60°C | - |
