- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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CUI Inc. |
Consulta
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-252, 8 X
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0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPAK) | 0.400" (10.16mm) | 10.05°C/W @ 200 LFM | ||
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CUI Inc. |
Consulta
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-263, 14.
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0.590" (14.99mm) | 1.020" (25.91mm) | TO-263 (D2Pak) | 0.375" (9.52mm) | 8.15°C/W @ 200 LFM |
