- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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CUI Inc. |
Consulta
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 63
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2.480" (63.00mm) | 1.359" (34.50mm) | TO-220 | 0.492" (12.50mm) | 9.10°C/W @ 200 LFM | ||
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CUI Inc. |
Consulta
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION,TO-218, 31.
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1.250" (31.75mm) | 1.654" (42.00mm) | TO-218 | 0.984" (25.00mm) | 2.57°C/W @ 200 LFM |
