- Material:
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- Length:
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- Width:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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- Condiciones seleccionadas:
Descubre los productos 13
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | ||
Aavid,Thermal Division of Boyd Corporation |
51,138
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 BLK
|
- | Board Level | Aluminum | Rectangular,Fins | 0.700" (17.78mm) | 1.750" (44.45mm) | Bolt On | TO-220 | 0.375" (9.52mm) | 2.0W @ 40°C | 15.60°C/W | Black Anodized | ||||
Wakefield-Vette |
5,350
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Adhesive | BGA | 0.250" (6.35mm) | 2.0W @ 40°C | - | Black Anodized | ||||
Wakefield-Vette |
3,457
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK
|
658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.250" (6.35mm) | 2.0W @ 40°C | - | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
5,835
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TABS BLACK
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 30°C | 12.50°C/W | Black Anodized | ||||
Wakefield-Vette |
839
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | 2.0W @ 40°C | - | Black Anodized | ||||
Wakefield-Vette |
642
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | 2.0W @ 40°C | - | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.700" (17.78mm) | 1.750" (44.45mm) | Bolt On and PC Pin | TO-220 | 0.375" (9.52mm) | 2.0W @ 40°C | 15.60°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Copper | Rectangular, Fins | 1.025" (26.04mm) | 1.005" (25.53mm) | Clip and PC Pin | TO-220 | 0.610" (15.49mm) | 1.5W @ 40°C | 20.00°C/W | Tin | ||||
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | 2.0W @ 40°C | - | Black Anodized | ||||
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | 2.0W @ 40°C | - | Black Anodized | ||||
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | 2.0W @ 40°C | - | Black Anodized | ||||
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 30°C | - | Black Anodized | ||||
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 17.8X44.5X9.5MM
|
- | Board Level | Aluminum | Rectangular, Fins | 0.700" (17.78mm) | 1.750" (44.45mm) | Bolt On | TO-220 | 0.375" (9.52mm) | 2.0W @ 40°C | - | Black Anodized |