Descubre los productos 13
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Type Material Shape Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Natural Material Finish
507002B00000G
Aavid,Thermal Division of Boyd Corporation
51,138
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 BLK
- Board Level Aluminum Rectangular,Fins 0.700" (17.78mm) 1.750" (44.45mm) Bolt On TO-220 0.375" (9.52mm) 2.0W @ 40°C 15.60°C/W Black Anodized
658-25ABT4E
Wakefield-Vette
5,350
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/TAPE
658 Top Mount Aluminum Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) Adhesive BGA 0.250" (6.35mm) 2.0W @ 40°C - Black Anodized
658-25AB
Wakefield-Vette
3,457
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK
658 Top Mount Aluminum Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Not Included) BGA 0.250" (6.35mm) 2.0W @ 40°C - Black Anodized
6021BG
Aavid, Thermal Division of Boyd Corporation
5,835
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 TABS BLACK
- Board Level, Vertical Aluminum Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) Bolt On and PC Pin TO-220 0.500" (12.70mm) 2.0W @ 30°C 12.50°C/W Black Anodized
658-25ABT1E
Wakefield-Vette
839
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/TAPE
658 Top Mount Aluminum Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Included) BGA 0.250" (6.35mm) 2.0W @ 40°C - Black Anodized
658-25ABT3
Wakefield-Vette
642
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/TAPE
658 Top Mount Aluminum Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Included) BGA 0.250" (6.35mm) 2.0W @ 40°C - Black Anodized
507002B05300G
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- Board Level, Vertical Aluminum Rectangular, Fins 0.700" (17.78mm) 1.750" (44.45mm) Bolt On and PC Pin TO-220 0.375" (9.52mm) 2.0W @ 40°C 15.60°C/W Black Anodized
7138DG
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- Board Level, Vertical Copper Rectangular, Fins 1.025" (26.04mm) 1.005" (25.53mm) Clip and PC Pin TO-220 0.610" (15.49mm) 1.5W @ 40°C 20.00°C/W Tin
658-25ABT1
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/TAPE
658 Top Mount Aluminum Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Included) BGA 0.250" (6.35mm) 2.0W @ 40°C - Black Anodized
658-25ABT2
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/TAPE
658 Top Mount Aluminum Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Included) BGA 0.250" (6.35mm) 2.0W @ 40°C - Black Anodized
658-25ABT4
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/TAPE
658 Top Mount Aluminum Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Included) BGA 0.250" (6.35mm) 2.0W @ 40°C - Black Anodized
822202B00000
Comair Rotron
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK STAMP 25.4X12.7X30MM
- Board Level, Vertical Aluminum Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) Bolt On and PC Pin TO-220 0.500" (12.70mm) 2.0W @ 30°C - Black Anodized
822802B00000
Comair Rotron
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK STAMP 17.8X44.5X9.5MM
- Board Level Aluminum Rectangular, Fins 0.700" (17.78mm) 1.750" (44.45mm) Bolt On TO-220 0.375" (9.52mm) 2.0W @ 40°C - Black Anodized