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- Length：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 16
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
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Wakefield-Vette |
2,632
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 40.6MM SQ H=.525"
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655 | Top Mount | Square, Pin Fins | 1.600" (40.64mm) | 1.600" (40.64mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.522" (13.27mm) | 4.0W @ 40°C | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
2,329
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-3 12W H=1.25" BLK
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- | Board Level | Square, Pin Fins | 1.810" (45.97mm) | 1.810" (45.97mm) | Bolt On | TO-3 | 1.250" (31.75mm) | 10.0W @ 50°C | 5.00°C/W | Black Anodized | ||
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Wakefield-Vette |
4,378
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 43MM SQ BLK H=.65"
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628 | Top Mount | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.650" (16.51mm) | 3.0W @ 20°C | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
2,586
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 1.75" HIGH RISE TO-220
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- | Board Level, Vertical | Rectangular, Fins | 1.750" (44.45mm) | 0.750" (19.05mm) | Clip and Board Mounts | TO-220 | 1.750" (44.45mm) | 4.0W @ 30°C | 6.30°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
1,820
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 SOLDERPIN 38.1MM
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- | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 6.0W @ 40°C | 5.50°C/W | Black Anodized | ||
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Ohmite |
137
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-247 TO-264 BLK
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M | Top Mount | Rectangular, Fins | 2.170" (55.12mm) | 1.350" (34.30mm) | Clip and PC Pin | TO-247, TO-264 | 1.520" (38.61mm) | 16.0W @ 43°C | - | Black Anodized | ||
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Ohmite |
159
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-247 TO-264
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M | Top Mount | Rectangular, Fins | 2.170" (55.12mm) | 1.350" (34.30mm) | Clip and PC Pin | TO-247, TO-264 | 1.520" (38.61mm) | 16.0W @ 43°C | - | Degreased | ||
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Aavid, Thermal Division of Boyd Corporation |
7
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3 dias |
-
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MOQ: 1 MPQ: 1
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66365 EXTRUSION 0.63X1.5"X4
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- | Top Mount | Rectangular, Pin Fins | 48.000" (1219.20mm) | 1.500" (38.10mm) | Adhesive | - | 0.630" (16.00mm) | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 PIN BLACK
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- | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 4.0W @ 30°C | 4.40°C/W | Black Anodized | ||
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ASSMANN WSW Components |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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FINGER-SHAPED-HEATSINK 8K/W
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- | Board Level | Rectangular, Fins | 1.880" (47.75mm) | 1.400" (35.56mm) | Bolt On | - | 1.250" (31.75mm) | 1.0W @ 10°C | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | Bolt On | TO-220 | 1.000" (25.40mm) | 6.0W @ 40°C | 5.50°C/W | Black Anodized | ||
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Wakefield-Vette |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 43MM SQ BLK H=.65"
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628 | Top Mount | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.650" (16.51mm) | 3.0W @ 20°C | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | Square, Angled Fins | 1.750" (44.45mm) | 0.490" (12.44mm) | Bolt On and Board Mounts | TO-220, TO-218 | 1.750" (44.45mm) | 4.0W @ 30°C | 6.30°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Square, Fins | 1.780" (45.21mm) | 1.780" (45.21mm) | Bolt On | TO-3 | 1.220" (31.00mm) | 4.0W @ 30°C | 6.60°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Rhombus | 1.550" (39.37mm) | 1.550" (39.37mm) | Bolt On | TO-3 | 1.750" (44.45mm) | 10.0W @ 50°C | 4.50°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Rhombus | 1.550" (39.37mm) | 1.550" (39.37mm) | Bolt On | TO-3 | 1.500" (38.10mm) | 6.0W @ 30°C | 4.80°C/W | Black Anodized |
