Wakefield-Vette

655-53AB

Descripción :
HEATSINK CPU 40.6MM SQ H=.525"
Attachment Method :
Thermal Tape, Adhesive (Not Included)
Diameter :
-
Height Off Base (Height of Fin) :
0.522" (13.27mm)
Length :
1.600" (40.64mm)
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise :
4.0W @ 40°C
Series :
655
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
2.00°C/W @ 400 LFM
Thermal Resistance @ Natural :
-
Type :
Top Mount
Width :
1.600" (40.64mm)

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