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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 37
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Width | Diameter | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Width | Diameter | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Apex Microtechnology |
688
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO3
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Apex Precision Power | Board Level | 1.630" (41.40mm) | 1.290" (32.77mm) | - | TO-3 | 0.750" (19.05mm) | 7.0W @ 80°C | 14.00°C/W @ 200 LFM | 11.70°C/W | ||
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Apex Microtechnology |
422
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TOP MT TO-3
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Apex Precision Power | Top Mount | 1.600" (40.64mm) | 1.000" (25.40mm) | - | TO-3 | 1.000" (25.40mm) | 1.5W @ 20°C | 2.00°C/W @ 600 LFM | 11.60°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
5,511
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK TO-3 .500" COMPACT
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- | Board Level | 1.880" (47.75mm) | 1.400" (35.56mm) | - | TO-3 | 0.500" (12.70mm) | 2.0W @ 30°C | 4.00°C/W @ 300 LFM | 12.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
1,707
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK TO-3 .750" COMPACT
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- | Board Level | 1.880" (47.75mm) | 1.400" (35.56mm) | - | TO-3 | 0.750" (19.05mm) | 4.0W @ 40°C | 3.00°C/W @ 400 LFM | 10.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
2,970
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK TO-3 1.25" COMPACT
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- | Board Level | 1.880" (47.75mm) | 1.400" (35.56mm) | - | TO-3 | 1.250" (31.75mm) | 4.0W @ 30°C | 3.00°C/W @ 200 LFM | 7.80°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
8,223
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-3 BLACK .87"
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- | Top Mount | 1.540" (39.12mm) | - | 1.125" (28.57mm) OD | TO-3 | 0.870" (22.10mm) | 2.5W @ 40°C | 4.00°C/W @ 600 LFM | 12.50°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
6,006
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-3 1.00" BLK
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- | Board Level | 1.880" (47.75mm) | 1.400" (35.56mm) | - | TO-3 | 1.000" (25.40mm) | 5.0W @ 40°C | 2.00°C/W @ 500 LFM | 8.40°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
2,558
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 12W 1.25"H SPACE SAVER
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- | Board Level | 1.630" (41.40mm) | 1.290" (32.77mm) | - | - | 1.250" (31.75mm) | - | - | - | ||
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Advanced Thermal Solutions Inc. |
2,884
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-3
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- | Board Level | 2.507" (63.67mm) | 1.867" (47.41mm) | - | TO-3 | 1.667" (42.33mm) | - | 2.60°C/W @ 200 LFM | 7.50°C/W | |||
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CTS Thermal Management Products |
267
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK PWR .75"H BLACK TO-220
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- | Board Level | 1.310" (33.27mm) | 0.900" (22.86mm) | - | TO-126, TO-220 | 0.750" (19.05mm) | - | 7.00°C/W @ 200 LFM | 50.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | 1.630" (41.40mm) | 1.290" (32.77mm) | - | TO-3 | 0.750" (19.05mm) | 2.0W @ 30°C | 4.00°C/W @ 200 LFM | 13.40°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | 1.630" (41.40mm) | 1.290" (32.77mm) | - | TO-3 | 0.500" (12.70mm) | 3.0W @ 50°C | 3.00°C/W @ 600 LFM | 15.60°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | 1.630" (41.40mm) | 1.290" (32.77mm) | - | TO-3 | 1.000" (25.40mm) | 5.0W @ 50°C | 3.50°C/W @ 200 LFM | 11.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | 1.630" (41.40mm) | 1.290" (32.77mm) | - | TO-3 | 1.250" (31.75mm) | 7.0W @ 70°C | 3.00°C/W @ 300 LFM | 9.80°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 6W/.75"H SPACE SAVER
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- | Board Level | 1.630" (41.40mm) | 1.290" (32.77mm) | - | - | 0.750" (19.05mm) | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | 1.550" (39.37mm) | 1.040" (26.42mm) | - | TO-66 | 1.250" (31.75mm) | 7.0W @ 50°C | 4.00°C/W @ 200 LFM | 8.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | 1.550" (39.37mm) | 1.040" (26.42mm) | - | TO-66 | 0.500" (12.70mm) | 2.0W @ 30°C | 7.00°C/W @ 200 LFM | 10.70°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | 1.550" (39.37mm) | 1.040" (26.42mm) | - | TO-66 | 0.750" (19.05mm) | 6.0W @ 60°C | 2.00°C/W @ 800 LFM | 9.60°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | 1.550" (39.37mm) | 1.040" (26.42mm) | - | TO-66 | 1.000" (25.40mm) | 4.0W @ 40°C | 4.00°C/W @ 300 LFM | 8.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 8W/1.00"H SPACE SAVER
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- | Board Level | 1.630" (41.40mm) | 1.290" (32.77mm) | - | - | 1.000" (25.40mm) | - | - | - |
