- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
5,511
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3 dias |
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MOQ: 1 MPQ: 1
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HEAT SINK TO-3 .500" COMPACT
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1.880" (47.75mm) | 1.400" (35.56mm) | TO-3 | 0.500" (12.70mm) | 4.00°C/W @ 300 LFM | 12.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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1.630" (41.40mm) | 1.290" (32.77mm) | TO-3 | 0.750" (19.05mm) | 4.00°C/W @ 200 LFM | 13.40°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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1.550" (39.37mm) | 1.040" (26.42mm) | TO-66 | 0.500" (12.70mm) | 7.00°C/W @ 200 LFM | 10.70°C/W |
