- Length：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 18
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
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Wakefield-Vette |
2,805
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.450" (11.43mm) | 6.00°C/W @ 200 LFM | - | ||
|
|
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Aavid, Thermal Division of Boyd Corporation |
6,523
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SNAP-DOWN .75"
|
- | Board Level | Rectangular, Fins | 0.750" (19.05mm) | 0.980" (24.89mm) | Clip | TO-220 | 0.440" (11.18mm) | 6.00°C/W @ 500 LFM | 16.80°C/W | ||
|
|
|
Wakefield-Vette |
1,176
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQBLK W/O TAPE
|
658 | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.450" (11.43mm) | 6.00°C/W @ 200 LFM | - | ||
|
|
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Aavid, Thermal Division of Boyd Corporation |
2,862
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.5W BLK W/PINS
|
- | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 0.640" (16.26mm) | Bolt On and PC Pin | TO-220 | 0.640" (16.26mm) | 5.00°C/W @ 200 LFM | 16.80°C/W | ||
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|
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Wakefield-Vette |
2,433
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SLIM VERT BLACK TO-220
|
634 | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 0.640" (16.26mm) | Bolt On and PC Pin | TO-220 | 0.640" (16.26mm) | 2.00°C/W @ 300 LFM | 50.00°C/W | ||
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|
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Wakefield-Vette |
673
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.450" (11.43mm) | 6.00°C/W @ 200 LFM | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
10,100
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SNAP-DOWN .75"
|
- | Board Level | Rectangular, Fins | 0.750" (19.05mm) | 0.980" (24.89mm) | Clip | TO-220 | 0.440" (11.18mm) | 6.00°C/W @ 500 LFM | 16.80°C/W | ||
|
|
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Aavid, Thermal Division of Boyd Corporation |
5,824
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.375" (34.93mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 4.00°C/W @ 700 LFM | 13.00°C/W | ||
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Ohmite |
302
|
3 dias |
-
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MOQ: 1 MPQ: 1
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BLACK ANODIZED HEATSINK
|
EX | Board Level, Vertical | Rectangular, Fins | 0.641" (16.28mm) | 0.642" (16.30mm) | Bolt On and Board Mounts | TO-220 | 1.500" (38.10mm) | 5.00°C/W @ 200 LFM | 14.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.5W H=1.5" BLK
|
- | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 0.640" (16.26mm) | Bolt On | TO-220 | 0.640" (16.26mm) | 3.00°C/W @ 500 LFM | - | ||
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Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SLIM VERT BLACK TO-220
|
634 | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 0.640" (16.26mm) | Bolt On | TO-220, TO-218 | 0.640" (16.26mm) | 2.00°C/W @ 300 LFM | 50.00°C/W | ||
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|
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Rhombus | 1.630" (41.40mm) | 1.290" (32.77mm) | Bolt On | TO-3 | 0.500" (12.70mm) | 3.00°C/W @ 600 LFM | 15.60°C/W | ||
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|
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 0.640" (16.26mm) | Bolt On and PC Pin | TO-220 | 0.640" (16.26mm) | 5.00°C/W @ 200 LFM | 16.80°C/W | ||
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|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Rectangular, Fins | 0.900" (22.86mm) | 1.020" (25.91mm) | Clip and PC Pin | TO-202 | 0.420" (10.67mm) | 8.00°C/W @ 200 LFM | 16.80°C/W | ||
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|
|
CTS Thermal Management Products |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK HORZ .50"H BLACK TO-220
|
7 | Board Level | Rectangular, Fins | 0.682" (17.32mm) | 1.750" (44.45mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | - | - | ||
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|
|
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.450" (11.43mm) | 6.00°C/W @ 200 LFM | - | ||
|
|
|
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.450" (11.43mm) | 6.00°C/W @ 200 LFM | - | ||
|
|
|
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SLIM VERT BLACK TO-220
|
634 | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 0.640" (16.26mm) | Bolt On and PC Pin | TO-220, TO-218 | 0.640" (16.26mm) | 2.00°C/W @ 300 LFM | 50.00°C/W |
