- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Condiciones seleccionadas:
Descubre los productos 5
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,215
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .515"TO-220
|
Board Level, Vertical | 0.848" (21.55mm) | Clip and PC Pin | 1.0W @ 30°C | 6.00°C/W @ 500 LFM | 19.70°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
9,535
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TIN CLIP-ON 13MM
|
Board Level | 0.780" (19.81mm) | Clip and PC Pin | 1.5W @ 50°C | 8.00°C/W @ 500 LFM | 28.30°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
761
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .515"TO-220
|
Board Level, Vertical | 0.780" (19.81mm) | Clip and PC Pin | 1.0W @ 30°C | 10.00°C/W @ 200 LFM | 20.30°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
976
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TIN CLIP-ON 21MM
|
Board Level | 0.780" (19.81mm) | Clip and Board Locks | 1.0W @ 30°C | 8.00°C/W @ 400 LFM | 20.30°C/W | ||
|
|
|
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 13.1X13.2X24MM
|
Board Level, Vertical | 0.848" (21.55mm) | Clip and PC Pin | 0.5W @ 20°C | 12.00°C/W @ 500 LFM | - |
