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Descubre los productos 11
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
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Advanced Thermal Solutions Inc. |
1,458
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TRIPLE TO-126 COPPER
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- | Board Level, Vertical | Copper | Rectangular, Fins | 1.759" (44.68mm) | 1.750" (44.45mm) | Clip and Board Mounts | TO-126 | 0.400" (10.16mm) | - | 15.00°C/W | Tin | |||
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CUI Inc. |
488
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4.1W ALUMINUM
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.441" (11.20mm) | 0.866" (22.00mm) | PC Pin | TO-220 | 0.626" (15.90mm) | 4.1W @ 75°C | 18.34°C/W | Black Anodized | ||
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CUI Inc. |
486
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4.1W ALUMINUM
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- | Board Level | Aluminum | Rectangular, Fins | 0.625" (15.90mm) | 0.866" (22.00mm) | - | TO-220 | 0.440" (11.18mm) | 4.1W @ 75°C | 18.34°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
52
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 19MM X 19MM X 24.5MM
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- | Top Mount | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | 0.3W @ 20°C | - | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
99
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 21MM X 21MM X 24.5MM
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- | Top Mount | Aluminum | Square, Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | - | - | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
87
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 25MM X 32MM X 13MM
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maxiGRIP | Top Mount | Aluminum | Rectangular, Angled Fins | 0.984" (25.00mm) | 1.260" (32.00mm) | Clip | Flip Chip Processors | 0.512" (13.00mm) | - | - | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK CLIP-ON TO-220 BLACK
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- | Board Level | Aluminum | Rectangular | 1.035" (26.29mm) | 0.799" (20.30mm) | Adhesive | TO-220 | 0.241" (6.11mm) | - | 23.00°C/W | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK 32.5X32.5X14.5MM NO TIM
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- | Top Mount | Aluminum | Square, Pin Fins | 1.280" (32.51mm) | 1.280" (32.51mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.571" (14.50mm) | - | - | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK 19X19X24.5MM W/OUT TIM
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- | Top Mount | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.964" (24.50mm) | 0.3W @ 20°C | - | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
22
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 32.5 X 32.5 X 14.5MM
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- | Top Mount | Aluminum | Square, Pin Fins | 1.280" (32.51mm) | 1.280" (32.51mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | - | - | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK 21X21X24.5MM W/OUT TIM
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- | Top Mount | Aluminum | Square, Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.964" (24.50mm) | - | - | Black Anodized |
