Fabricante:
Material:
Attachment Method:
Package Cooled:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Material Finish:
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La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Material Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Natural Material Finish
ATS-PCB1061
Advanced Thermal Solutions Inc.
1,458
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TRIPLE TO-126 COPPER
Copper 1.759" (44.68mm) 1.750" (44.45mm) Clip and Board Mounts TO-126 0.400" (10.16mm) - 15.00°C/W Tin
HSS-B20-095H
CUI Inc.
488
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 4.1W ALUMINUM
Aluminum 0.441" (11.20mm) 0.866" (22.00mm) PC Pin TO-220 0.626" (15.90mm) 4.1W @ 75°C 18.34°C/W Black Anodized