- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Condiciones seleccionadas:
Descubre los productos 9
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
ASSMANN WSW Components |
1,010
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 12.70X26.20MM
|
SMD Pad | 0.390" (9.91mm) | - | - | 23.00°C/W | ||
|
|
Advanced Thermal Solutions Inc. |
2,297
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 COPPER
|
- | 0.402" (10.21mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | |||
|
|
|
ASSMANN WSW Components |
3,600
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 12.70X26.20MM
|
SMD Pad | 0.390" (9.91mm) | - | - | 23.00°C/W | ||
|
|
|
ASSMANN WSW Components |
3,836
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 12.70X26.20MM
|
SMD Pad | 0.390" (9.91mm) | - | - | 23.00°C/W | ||
|
|
|
ASSMANN WSW Components |
3,836
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 12.70X26.20MM
|
SMD Pad | 0.390" (9.91mm) | - | - | 23.00°C/W | ||
|
|
Advanced Thermal Solutions Inc. |
2,750
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 COPPER
|
- | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | |||
|
|
Advanced Thermal Solutions Inc. |
2,833
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 COPPER
|
- | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | |||
|
|
Advanced Thermal Solutions Inc. |
2,833
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 COPPER
|
- | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | |||
|
|
|
Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 26.2X12.7X9.9MM
|
SMD Pad | 0.390" (9.91mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | - |
