- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 4
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
4,500
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-218 SOLDER PIN
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Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218 | 1.000" (25.40mm) | 4.00°C/W @ 200 LFM | 5.50°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218 | 1.000" (25.40mm) | 4.00°C/W @ 200 LFM | 5.50°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | Clip and PC Pin | TO-220 | 1.000" (25.40mm) | 4.00°C/W @ 200 LFM | 5.70°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Square, Pin Fins | 1.810" (45.97mm) | 1.810" (45.97mm) | Bolt On | TO-3 | 0.750" (19.05mm) | 1.50°C/W @ 700 LFM | 6.20°C/W |
