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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 4
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Ohmite |
24
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3 dias |
-
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MOQ: 1 MPQ: 1
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ALUMINUM HEATSINK 25MM DEGREASED
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CR | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 0.984" (25.00mm) | 2.953" (75.00mm) | 2 Clips and PC Pin | TO-401 | - | - | - | Degreased | ||
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Ohmite |
24
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3 dias |
-
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MOQ: 1 MPQ: 1
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ALUMINUM HEATSINK 25MM BLK ANODI
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CR | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 0.984" (25.00mm) | 2.953" (75.00mm) | 2 Clips and PC Pin | TO-401 | - | - | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Aluminum | Rhombus | 1.550" (39.37mm) | 1.550" (39.37mm) | Bolt On | TO-3 | 1.225" (31.12mm) | 5.0W @ 30°C | 3.00°C/W @ 200 LFM | Black Anodized | ||
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CTS Thermal Management Products |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK PWR .90"H BLACK TO-3
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HP1 | Board Level | Aluminum | Square, Pin Fins | 2.500" (63.50mm) | 2.500" (63.50mm) | Bolt On | TO-3 | 0.900" (22.86mm) | - | - | Black Anodized |
