- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Length | Width | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Length | Width | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Wakefield-Vette |
2,779
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQ BLK W/TAPE
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658 | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | BGA | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | Black Anodized | ||
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Adafruit Industries LLC |
1,256
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3 dias |
-
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MOQ: 1 MPQ: 1
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ALUMINIUM HEATSINK FOR RASPBERRY
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- | Square, Fins | 0.600" (15.24mm) | 0.600" (15.24mm) | Raspberry Pi | - | - | - |
