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- Diameter：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Diameter | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Diameter | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
9,436
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-5 .4" BLK
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Top Mount | 0.315" (8.00mm) ID, 0.750" (19.05mm) OD | 0.400" (10.16mm) | 0.5W @ 30°C | 15.00°C/W @ 400 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
1,003
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-5 2W BLK
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Board Level | 0.318" (8.07mm) ID, 0.750" (19.05mm) OD | 0.250" (6.35mm) | 1.4W @ 70°C | 35.00°C/W @ 200 LFM |
