Material:
Attachment Method:
Package Cooled:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Material Finish:
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La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Type Material Shape Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
218-40CT3
Wakefield-Vette
Consulta
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MOQ: 1  MPQ: 1
HEATSINK ALUM BLACK SMD
Top Mount Copper Rectangular, Fins 0.320" (8.13mm) 0.900" (22.86mm) SMD Pad SMD 0.400" (10.16mm) 2.0W @ 62°C 21.00°C/W @ 200 LFM 31.00°C/W Tin
218-40CTE3
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK ALUM BLACK SMD
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218-40CT5
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK ALUM NATURAL SMD
Top Mount Copper Rectangular, Fins 0.500" (12.70mm) 1.030" (26.16mm) SMD Pad SMD 0.400" (10.16mm) 2.3W @ 40°C 5.00°C/W @ 600 LFM 31.00°C/W Tin
218-40CTE5
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK ALUM NATURAL SMD
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