- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Advanced Thermal Solutions Inc. |
78
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3 dias |
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MOQ: 1 MPQ: 1
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HEAT SINK 33MM X 33MM X 14.5MM
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Top Mount | Square, Pin Fins | 1.299" (32.99mm) | 1.299" (32.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | - | - | |||
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CUI Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 3.2W ALUMINUM
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Board Level, Vertical | Rectangular, Fins | 0.500" (12.70mm) | 0.500" (12.70mm) | PC Pin | TO-220 | 0.748" (19.00mm) | 3.2W @ 75°C | 23.81°C/W | ||
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Advanced Thermal Solutions Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK 33X33X14.5MM W/OUT TIM
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Top Mount | Square, Pin Fins | 1.299" (32.99mm) | 1.299" (32.99mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.571" (14.50mm) | - | - |
