- Material:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Material Finish:
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- Condiciones seleccionadas:
Descubre los productos 3
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | ||
Advanced Thermal Solutions Inc. |
20
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 300X36.28MM
|
- | Top Mount | Aluminum | 11.800" (299.72mm) | 1.417" (36.00mm) | Adhesive | - | 1.102" (28.00mm) | - | 5.40°C/W @ 200 LFM | Degreased | ||||
Ohmite |
93
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK BLACK ANODIZED
|
CSM | Board Level, Vertical | Aluminum | 1.575" (40.00mm) | 0.492" (12.50mm) | Solderable Feet | TO-220 | 1.228" (31.20mm) | 6.0W @ 65°C | - | Black Anodized | ||||
CUI Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 35
|
HSE | Board Level | Aluminum Alloy | 1.378" (35.00mm) | 1.142" (29.00mm) | Bolt On | TO-220 | 0.472" (12.00mm) | 6.2W @ 75°C | 2.91°C/W @ 200 LFM | Black Anodized |