- Attachment Method：
-
- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Condiciones seleccionadas:
Descubre los productos 2
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Wakefield-Vette |
543
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER TO-220 TO-247
|
- | Solderable Feet | TO-220, TO-247 | 3.80°C/W @ 200 LFM | 7.00°C/W | ||
|
|
|
Ohmite |
37
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
CERAMIC HEATSINK WITH CLIP
|
WC | Clip and PC Pin | TO-220, TO-247, TO-264 | - | 12.00°C/W |
