Material:
Attachment Method:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Material Finish:
Descubre los productos 6
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Material Length Attachment Method Package Cooled Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
6238B-MTG
Aavid, Thermal Division of Boyd Corporation
7,732
3 dias
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEATSINK .61" TO-220
Aluminum 1.159" (29.44mm) Clip and PC Pin TO-220 2.0W @ 40°C 6.00°C/W @ 600 LFM 13.60°C/W Black Anodized
6238BG
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Aluminum 1.159" (29.44mm) Clip TO-220 2.0W @ 40°C 6.00°C/W @ 600 LFM 13.60°C/W Black Anodized
6239BG
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Aluminum 1.159" (29.44mm) Clip TO-220 2.0W @ 40°C 6.00°C/W @ 600 LFM 13.60°C/W Black Anodized
6239B-MTG
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Aluminum 1.159" (29.44mm) Clip and PC Pin TO-220 2.0W @ 40°C 6.00°C/W @ 600 LFM 13.60°C/W Black Anodized
7138DG
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Copper 1.025" (26.04mm) Clip and PC Pin TO-220 1.5W @ 40°C 5.00°C/W @ 500 LFM 20.00°C/W Tin
7130DG
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Copper 1.025" (26.04mm) Clip and PC Pin TO-218 0.5W @ 20°C 4.00°C/W @ 500 LFM 23.10°C/W Tin