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- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Condiciones seleccionadas:
Descubre los productos 15
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | ||
Wakefield-Vette |
2,805
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.450" (11.43mm) | 3.0W @ 50°C | - | Black Anodized | ||||
Wakefield-Vette |
1,176
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQBLK W/O TAPE
|
658 | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | Thermal Tape, Adhesive (Not Included) | BGA | 0.450" (11.43mm) | 3.0W @ 50°C | - | Black Anodized | ||||
Wakefield-Vette |
673
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.450" (11.43mm) | 3.0W @ 50°C | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
837
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 23MM X 23MM X 24.5MM
|
- | Top Mount | Square, Fins | 0.900" (23.00mm) | 0.906" (23.01mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | - | - | Black Anodized | ||||
Ohmite |
92
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK DUAL FOR TO-220/247 BLK
|
W | Board Level, Vertical | Rectangular, Fins | 1.200" (30.48mm) | 1.710" (43.43mm) | - | Clip and PC Pin | TO-220, TO-247 (Dual) | 0.630" (16.00mm) | 4.0W @ 40°C | 5.00°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
63
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 24.5MM
|
- | Top Mount | Square, Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | 0.3W @ 20°C | - | Black Anodized | ||||
Ohmite |
27
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK DUAL FOR TO-220/247
|
W | Board Level, Vertical | Rectangular, Fins | 1.200" (30.48mm) | 1.710" (43.43mm) | - | Clip and PC Pin | TO-220, TO-247 (Dual) | 0.630" (16.00mm) | 4.0W @ 40°C | 6.00°C/W | Degreased | ||||
TE Connectivity AMP Connectors |
45
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK BGA 21MM 3FIN RADIAL
|
- | - | Cylindrical | - | - | 1.375" (34.92mm) OD | Clip | BGA | 0.467" (11.86mm) | - | 13.20°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-3 BLACK
|
- | Board Level | Rectangular, Fins | 2.100" (53.34mm) | 1.680" (42.67mm) | - | Bolt On | TO-220 | 1.522" (38.67mm) | - | 10.00°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 21X21X24.5MM W/OUT TIM
|
- | Top Mount | Square, Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | - | Thermal Tape, Adhesive (Not Included) | BGA | 0.964" (24.50mm) | 0.3W @ 20°C | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 23X23X24.5MM W/OUT TIM
|
- | Top Mount | Square, Fins | 0.900" (23.00mm) | 0.906" (23.01mm) | - | Thermal Tape, Adhesive (Not Included) | BGA | 0.964" (24.50mm) | - | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 32.5 X 32.5 X 9.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Square, Angled Fins | 1.280" (32.51mm) | 1.280" (32.51mm) | - | Clip, Thermal Material | BGA | 0.374" (9.50mm) | - | - | Black Anodized | ||||
TE Connectivity AMP Connectors |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK BGA 21MM 3FIN RADIAL
|
- | - | Cylindrical | - | - | 1.375" (34.92mm) OD | Clip | BGA | 0.442" (11.23mm) | - | 13.20°C/W | Black Anodized | ||||
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.450" (11.43mm) | 3.0W @ 50°C | - | Black Anodized | ||||
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.450" (11.43mm) | 3.0W @ 50°C | - | Black Anodized |