Descubre los productos 14
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Type Shape Length Width Diameter Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Natural
658-45ABT3
Wakefield-Vette
2,805
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/TAPE
658 Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - Thermal Tape, Adhesive (Included) BGA 0.450" (11.43mm) 3.0W @ 50°C -
658-45AB
Wakefield-Vette
1,176
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQBLK W/O TAPE
658 Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - Thermal Tape, Adhesive (Not Included) BGA 0.450" (11.43mm) 3.0W @ 50°C -
658-45ABT4E
Wakefield-Vette
673
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/TAPE
658 Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - Thermal Tape, Adhesive (Included) BGA 0.450" (11.43mm) 3.0W @ 50°C -
ATS-55230W-C1-R0
Advanced Thermal Solutions Inc.
837
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK 23MM X 23MM X 24.5MM
- Top Mount Square, Fins 0.900" (23.00mm) 0.906" (23.01mm) - Thermal Tape, Adhesive (Included) BGA 0.964" (24.50mm) - -
WA-DT2-101E
Ohmite
92
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK DUAL FOR TO-220/247 BLK
W Board Level, Vertical Rectangular, Fins 1.200" (30.48mm) 1.710" (43.43mm) - Clip and PC Pin TO-220, TO-247 (Dual) 0.630" (16.00mm) 4.0W @ 40°C 5.00°C/W
ATS-54210W-C1-R0
Advanced Thermal Solutions Inc.
63
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK 21MM X 21MM X 24.5MM
- Top Mount Square, Fins 0.827" (21.00mm) 0.827" (21.00mm) - Thermal Tape, Adhesive (Included) BGA 0.964" (24.50mm) 0.3W @ 20°C -
5-1542004-4
TE Connectivity AMP Connectors
45
3 dias
-
MOQ: 1  MPQ: 1
HEAT SINK BGA 21MM 3FIN RADIAL
- - Cylindrical - - 1.375" (34.92mm) OD Clip BGA 0.467" (11.86mm) - 13.20°C/W
ATS-PCB1027
Advanced Thermal Solutions Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK TO-3 BLACK
- Board Level Rectangular, Fins 2.100" (53.34mm) 1.680" (42.67mm) - Bolt On TO-220 1.522" (38.67mm) - 10.00°C/W
ATS-54210W-C0-R0
Advanced Thermal Solutions Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK 21X21X24.5MM W/OUT TIM
- Top Mount Square, Fins 0.827" (21.00mm) 0.827" (21.00mm) - Thermal Tape, Adhesive (Not Included) BGA 0.964" (24.50mm) 0.3W @ 20°C -
ATS-55230W-C0-R0
Advanced Thermal Solutions Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK 23X23X24.5MM W/OUT TIM
- Top Mount Square, Fins 0.900" (23.00mm) 0.906" (23.01mm) - Thermal Tape, Adhesive (Not Included) BGA 0.964" (24.50mm) - -
ATS-51325D-C1-R0
Advanced Thermal Solutions Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
HEAT SINK 32.5 X 32.5 X 9.5MM
maxiGRIP, maxiFLOW Top Mount Square, Angled Fins 1.280" (32.51mm) 1.280" (32.51mm) - Clip, Thermal Material BGA 0.374" (9.50mm) - -
7-1542004-3
TE Connectivity AMP Connectors
Consulta
-
-
MOQ: 1  MPQ: 1
HEAT SINK BGA 21MM 3FIN RADIAL
- - Cylindrical - - 1.375" (34.92mm) OD Clip BGA 0.442" (11.23mm) - 13.20°C/W
658-45ABT2
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/TAPE
658 Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - Thermal Tape, Adhesive (Included) BGA 0.450" (11.43mm) 3.0W @ 50°C -
658-45ABT4
Wakefield-Vette
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/TAPE
658 Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - Thermal Tape, Adhesive (Included) BGA 0.450" (11.43mm) 3.0W @ 50°C -