- Attachment Method:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Condiciones seleccionadas:
Descubre los productos 5
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
Aavid, Thermal Division of Boyd Corporation |
1,014
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIP-ON/TAB
|
Board Level, Vertical | 1.500" (38.10mm) | 0.500" (12.70mm) | Clip and PC Pin | TO-220 | 3.0W @ 60°C | 7.00°C/W @ 200 LFM | ||||
Aavid, Thermal Division of Boyd Corporation |
1,742
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 BLACK CLIP-ON
|
Board Level | 1.500" (38.10mm) | 0.500" (12.70mm) | Clip | TO-220 | 3.0W @ 60°C | 7.00°C/W @ 200 LFM | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | 1.500" (38.10mm) | 0.500" (12.70mm) | Clip and PC Pin | TO-220 | 3.0W @ 60°C | 7.00°C/W @ 200 LFM | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | 0.850" (21.59mm) | 1.000" (25.40mm) | Clip | TO-220, TO-262 | 2.0W @ 40°C | 9.00°C/W @ 200 LFM | ||||
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | 0.850" (21.59mm) | 1.000" (25.40mm) | Clip and PC Pin | TO-220, TO-262 | 2.0W @ 40°C | 9.00°C/W @ 200 LFM |