- Width:
-
- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
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- Condiciones seleccionadas:
Descubre los productos 1,550
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Advanced Thermal Solutions Inc. |
171
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X22.86MM FP
|
pushPIN | Top Mount | Rectangular, Fins | 2.280" (57.90mm) | 2.400" (60.96mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 7.31°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
93
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X22.86MM FP
|
pushPIN | Top Mount | Rectangular, Fins | 2.280" (57.90mm) | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 14.33°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
63
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X22.86MM FP
|
pushPIN | Top Mount | Rectangular, Fins | 1.450" (36.83mm) | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 6.42°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
92
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X22.86MM T766
|
pushPIN | Top Mount | Rectangular, Fins | 2.280" (57.90mm) | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 14.33°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
88
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X22.86MM T766
|
pushPIN | Top Mount | Rectangular, Fins | 1.450" (36.83mm) | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 6.42°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
94
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X22.86MM T766
|
pushPIN | Top Mount | Rectangular, Fins | 2.280" (57.90mm) | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 14.33°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
73
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X22.86MM T766
|
pushPIN | Top Mount | Rectangular, Fins | 2.280" (57.90mm) | 2.400" (60.96mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 7.31°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
94
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X22.86MM T766
|
pushPIN | Top Mount | Rectangular, Fins | 1.450" (36.83mm) | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 6.42°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
89
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X22.86MM T766
|
pushPIN | Top Mount | Rectangular, Fins | 2.280" (57.90mm) | 2.400" (60.96mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 7.31°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
90
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X22.86MM T766
|
pushPIN | Top Mount | Rectangular, Fins | 2.280" (57.90mm) | 2.400" (60.96mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 7.31°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
99
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X22.86MM T766
|
pushPIN | Top Mount | Rectangular, Fins | 2.280" (57.90mm) | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 14.33°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
95
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X22.86MM T766
|
pushPIN | Top Mount | Rectangular, Fins | 1.450" (36.83mm) | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 6.42°C/W @ 100 LFM | - | Blue Anodized | ||||
Apex Microtechnology |
2
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 6P DIP
|
Apex Precision Power | Board Level | Square, Pin Fins | 2.500" (63.50mm) | 2.500" (63.50mm) | Bolt On | 6-DIP | 3.0W @ 20°C | 30.00°C/W @ 500 LFM | 5.60°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X22.86MM FP
|
pushPIN | Top Mount | Rectangular, Fins | 2.280" (57.90mm) | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 14.31°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X22.86MM FP
|
pushPIN | Top Mount | Rectangular, Fins | 1.450" (36.83mm) | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 6.40°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X22.86MM FP
|
pushPIN | Top Mount | Rectangular, Fins | 2.280" (57.90mm) | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 14.40°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X22.86MM FP
|
pushPIN | Top Mount | Rectangular, Fins | 1.450" (36.83mm) | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 6.50°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X22.86MM FP
|
pushPIN | Top Mount | Rectangular, Fins | 2.280" (57.90mm) | 2.400" (60.96mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 7.30°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X60.96X22.86MM FP
|
pushPIN | Top Mount | Rectangular, Fins | 2.280" (57.90mm) | 2.400" (60.96mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 7.35°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 57.9X36.83X22.86MM
|
pushPIN | Top Mount | Rectangular, Fins | 2.280" (57.90mm) | 1.450" (36.83mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 14.31°C/W @ 100 LFM | - | Blue Anodized |