Descubre los productos 4
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Type Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow
6400BG
Aavid, Thermal Division of Boyd Corporation
4,063
3 dias
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- Board Level, Vertical 2.500" (63.50mm) 1.650" (41.91mm) Bolt On and PC Pin TO-218, TO-220, TO-247, Multiwatt 1.000" (25.40mm) 4.0W @ 20°C 1.50°C/W @ 400 LFM
HS29
Apex Microtechnology
6
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK 12P TO220 2.7C/W
Apex Precision Power Board Level 5.906" (150.00mm) 1.770" (44.96mm) Clip TO-220 1.181" (30.00mm) - -
6400B-P2G
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- Board Level, Vertical 2.500" (63.50mm) 1.650" (41.91mm) Bolt On and PC Pin TO-220 1.000" (25.40mm) 4.0W @ 20°C 1.50°C/W @ 400 LFM
533522B02552G
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- Board Level, Vertical 2.000" (50.80mm) 1.650" (41.91mm) Clip and PC Pin TO-220 (Dual) 1.000" (25.40mm) 6.0W @ 30°C 1.00°C/W @ 800 LFM