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- Shape：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 1,340
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
2,876
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-5 1.25W H=.25" BLK
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- | Top Mount | Aluminum | Cylindrical | - | 0.315" (8.00mm) ID, 0.750" (19.05mm) OD | Press Fit | TO-5 | 0.250" (6.35mm) | 1.0W @ 60°C | 25.00°C/W @ 200 LFM | 54.00°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
2,488
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK FOR TI MOD #TPA3130D
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
1,806
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK PIN-FIN W/TAPE
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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ASSMANN WSW Components |
56,109
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Top Mount | Aluminum | Cylindrical | - | 0.122" (3.10mm) ID, 0.235" (6.00mm) OD | Press Fit | - | 0.087" (2.20mm) | - | - | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
6,635
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 STAGGEREDFIN TIN
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
3,068
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-5 1W H=.375" BLK
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- | Board Level | Aluminum | Cylindrical | - | 0.318" (8.07mm) ID, 0.500" (12.70mm) OD | Press Fit | TO-5 | 0.375" (9.52mm) | 1.8W @ 90°C | 30.00°C/W @ 200 LFM | 57.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
1,468
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-5 1W H=.25"BLK
|
- | Board Level | Aluminum | Cylindrical | - | 0.305" (7.75mm) ID, 0.500" (12.70mm) OD | Press Fit | TO-5 | 0.250" (6.35mm) | 0.6W @ 40°C | 35.00°C/W @ 200 LFM | 63.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
4,925
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK TO-18 1W BLK
|
- | Top Mount | Aluminum | Cylindrical | - | 0.180" (4.57mm) ID, 0.500" (12.70mm) OD | Press Fit | TO-18 | 0.235" (5.97mm) | 0.6W @ 60°C | 30.00°C/W @ 500 LFM | 100.00°C/W | Black Anodized | ||
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Wakefield-Vette |
2,089
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/PINS BLK 1.5"
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
9,436
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-5 .4" BLK
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- | Top Mount | Aluminum | Cylindrical | - | 0.315" (8.00mm) ID, 0.750" (19.05mm) OD | Press Fit | TO-5 | 0.400" (10.16mm) | 0.5W @ 30°C | 15.00°C/W @ 400 LFM | 56.00°C/W | Black Anodized | ||
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Wakefield-Vette |
1,943
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/PINS
|
667 | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
1,003
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-5 2W BLK
|
- | Board Level | Aluminum | Cylindrical | - | 0.318" (8.07mm) ID, 0.750" (19.05mm) OD | Press Fit | TO-5 | 0.250" (6.35mm) | 1.4W @ 70°C | 35.00°C/W @ 200 LFM | 56.00°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
574
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TI TAS5622 AND TAS5624
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
488
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-5 2W BLK
|
- | Top Mount | Aluminum | Cylindrical | - | 0.750" (19.05mm) OD | Threaded Coupling | TO-5, TO-39 | 0.290" (7.37mm) | 0.5W @ 20°C | 20.00°C/W @ 300 LFM | 35.20°C/W | Black Anodized | ||
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ASSMANN WSW Components |
2,567
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Top Mount | Aluminum | Cylindrical | - | 0.122" (3.10mm) ID, 0.295" (7.50mm) OD | Press Fit | - | 0.157" (4.00mm) | - | - | - | Black Anodized | ||
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Wakefield-Vette |
1,546
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR STUD MT DIODE BLACK
|
695 | Board Level | Aluminum | - | - | 0.625" (15.88mm) ID, 1.330" (33.78mm) OD | Bolt On | Stud Mounted Diode | 0.530" (13.46mm) | 4.0W @ 72°C | 5.20°C/W @ 400 LFM | 18.00°C/W | Black Anodized | ||
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CTS Thermal Management Products |
953
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK PRESS ON .50"H BLK TO-5
|
7 | Top Mount | Aluminum | Cylindrical | - | 0.440" (11.18mm) OD | Press Fit | TO-5 | 0.500" (12.70mm) | 2.0W @ 60°C | - | 34.00°C/W | Black Anodized | ||
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Seeed Technology Co., Ltd |
636
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK KIT FOR RASPBERRY PI
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- | Top Mount | Aluminum | Square, Fins | - | - | Adhesive | - | - | - | - | - | - | |||
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Advanced Thermal Solutions Inc. |
2,373
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK FOR TI MOD #TAS5611PHD
|
- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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ASSMANN WSW Components |
1,866
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Top Mount | Aluminum | Cylindrical | - | 0.102" (2.60mm) ID, 0.315" (8.00mm) OD | Press Fit | - | 0.173" (4.40mm) | - | - | - | Black Anodized |
