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- Type：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 1,281
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Advanced Thermal Solutions Inc. |
2,488
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK FOR TI MOD #TPA3130D
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- | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
1,806
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK PIN-FIN W/TAPE
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- | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
6,635
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 STAGGEREDFIN TIN
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- | - | - | - | - | - | - | - | - | - | - | ||
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Wakefield-Vette |
2,089
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS BLK 1.5"
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- | - | - | - | - | - | - | - | - | - | - | ||
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Wakefield-Vette |
1,943
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS
|
667 | - | - | - | - | - | - | - | - | - | - | ||
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Advanced Thermal Solutions Inc. |
574
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TI TAS5622 AND TAS5624
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- | - | - | - | - | - | - | - | - | - | - | ||
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Wakefield-Vette |
1,546
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR STUD MT DIODE BLACK
|
695 | Board Level | Aluminum | 0.625" (15.88mm) ID, 1.330" (33.78mm) OD | Bolt On | Stud Mounted Diode | 0.530" (13.46mm) | 4.0W @ 72°C | 5.20°C/W @ 400 LFM | 18.00°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
2,373
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK FOR TI MOD #TAS5611PHD
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- | - | - | - | - | - | - | - | - | - | - | ||
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Advanced Thermal Solutions Inc. |
123
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TI TAS5612 AND TAS5614
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- | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
1,382
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 COPPER
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- | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
140
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SOLDER TAB BLACK
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- | - | - | - | - | - | - | - | - | - | - | ||
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Advanced Thermal Solutions Inc. |
481
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TI TAS5612 AND TAS5614
|
- | - | - | - | - | - | - | - | - | - | - | ||
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Advanced Thermal Solutions Inc. |
461
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK
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- | - | - | - | - | - | - | - | - | - | - | |||
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DFRobot |
183
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
RASPBERRY PI COPPER HEATSINK
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- | - | - | - | - | - | - | - | - | - | - | ||
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DFRobot |
14
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
PURE COPPER HEATSINK PACK OF 5 (
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LattePanda | - | - | - | - | - | - | - | - | - | - | ||
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CTS Thermal Management Products |
887
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CLIP ON BLACK TO-220
|
PSC2 | - | Aluminum | - | Clip | TO-220 | 0.810" (20.57mm) | - | - | 41.70°C/W | - | |||
|
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Advanced Thermal Solutions Inc. |
50
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
ROUND HEATPIPE 116W 5X70MM
|
- | - | - | - | - | - | - | - | - | - | - | |||
|
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Advanced Thermal Solutions Inc. |
47
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
ROUND HEATPIPE 81W 5X100MM
|
- | - | - | - | - | - | - | - | - | - | - | |||
|
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Advanced Thermal Solutions Inc. |
40
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
ROUND HEATPIPE 154W 6X70MM
|
- | - | - | - | - | - | - | - | - | - | - | |||
|
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Advanced Thermal Solutions Inc. |
50
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
ROUND HEATPIPE 108W 6X100MM
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