Fabricante:
Height Off Base (Height of Fin):
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
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La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Width Height Off Base (Height of Fin) Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
573300D00010G
Aavid, Thermal Division of Boyd Corporation
12,250
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK D2PAK .4" HIGH SMD
1.030" (26.16mm) 0.400" (10.16mm) 10.00°C/W @ 200 LFM 18.00°C/W
573300D00010G
Aavid, Thermal Division of Boyd Corporation
12,300
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK D2PAK .4" HIGH SMD
1.030" (26.16mm) 0.400" (10.16mm) 10.00°C/W @ 200 LFM 18.00°C/W
573300D00010G
Aavid, Thermal Division of Boyd Corporation
12,300
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK D2PAK .4" HIGH SMD
1.030" (26.16mm) 0.400" (10.16mm) 10.00°C/W @ 200 LFM 18.00°C/W
573300D00000G
Aavid, Thermal Division of Boyd Corporation
16,283
3 dias
-
MOQ: 1  MPQ: 1
TOP MOUNT HEATSINK .4" D2PAK
1.030" (26.16mm) 0.400" (10.16mm) 8.00°C/W @ 300 LFM 18.00°C/W
832700T00000
Comair Rotron
Consulta
-
-
MOQ: 1  MPQ: 1
HEATSINK STAMP 26.2X12.7X9.9MM
1.031" (26.20mm) 0.390" (9.91mm) 10.00°C/W @ 200 LFM -