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Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Wakefield-Vette |
158
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK EXTRUSION 12.32"
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- | Top Mount | 12.320" (312.93mm) | 3.420" (86.87mm) | Adhesive | Power Modules | 1.630" (41.40mm) | - | 30.00°C/W @ 200 LFM | - | ||
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Apex Microtechnology |
9
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 8P TO-3 .95C/W
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Apex Precision Power | Board Level | 3.000" (76.20mm) | 4.750" (120.65mm) | Bolt On | TO-3 | 3.000" (76.20mm) | 50.0W @ 60°C | 0.35°C/W @ 300 LFM | Black Anodized |
