- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
3,215
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3 dias |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .515"TO-220
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0.520" (13.21mm) | 0.515" (13.08mm) | 1.0W @ 30°C | 6.00°C/W @ 500 LFM | 19.70°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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0.900" (22.86mm) | 0.375" (9.52mm) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 20.80°C/W | ||
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Comair Rotron |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 13.1X13.2X24MM
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0.520" (13.21mm) | 0.515" (13.08mm) | 0.5W @ 20°C | 12.00°C/W @ 500 LFM | - |
