- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
3,215
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .515"TO-220
|
1.0W @ 30°C | 6.00°C/W @ 500 LFM | 19.70°C/W | ||
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Comair Rotron |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK STAMP 13.1X13.2X24MM
|
0.5W @ 20°C | 12.00°C/W @ 500 LFM | - |
