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- Condiciones seleccionadas:
Descubre los productos 17
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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t-Global Technology |
5,067
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3 dias |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC BOARD 10X10X2MM
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XL-25 | Heat Spreader | Ceramic | 0.393" (10.00mm) | 0.393" (10.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | - | - | ||
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t-Global Technology |
2,715
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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XL25 CERAMIC 10X10MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | 0.393" (10.00mm) | 0.393" (10.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.089" (2.25mm) | - | - | - | - | ||
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t-Global Technology |
5,198
|
3 dias |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC BOARD 20X20X2MM
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XL-25 | Heat Spreader | Ceramic | 0.787" (20.00mm) | 0.787" (20.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | - | - | ||
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t-Global Technology |
4,024
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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XL25 CERAMIC 20X20MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | 0.787" (20.00mm) | 0.787" (20.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.089" (2.25mm) | - | - | - | - | ||
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t-Global Technology |
1,228
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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XL25 CERAMIC 30X30MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | 1.181" (30.00mm) | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.085" (2.15mm) | - | - | - | - | ||
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|
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t-Global Technology |
4,410
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC BOARD 40X40X3MM
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XL-25 | Heat Spreader | Ceramic | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.118" (3.00mm) | - | - | - | - | ||
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|
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t-Global Technology |
946
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC 10X10MM W/LI98C ADH
|
XL-25 | Heat Spreader | Ceramic | 0.393" (10.00mm) | 0.393" (10.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.085" (2.15mm) | - | - | - | - | ||
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|
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t-Global Technology |
491
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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XL25 CERAMIC BOARD 30X30X2MM
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XL-25 | Heat Spreader | Ceramic | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | - | - | ||
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|
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t-Global Technology |
391
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC 20X20MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | 0.787" (20.00mm) | 0.787" (20.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.085" (2.15mm) | - | - | - | - | ||
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|
|
t-Global Technology |
266
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC BOARD 40X40X2MM
|
XL-25 | Heat Spreader | Ceramic | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | - | - | ||
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|
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t-Global Technology |
30
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3 dias |
-
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MOQ: 1 MPQ: 1
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IR HEAT SPREADER/EMITTER W/ADH
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PH3 | Heat Spreader | Copper | 3.937" (100.00mm) | 3.937" (100.00mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | - | Polyester | ||
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t-Global Technology |
38
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3 dias |
-
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MOQ: 1 MPQ: 1
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IR HEAT SPREADER/EMITTER W/ADH
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PH3 | Heat Spreader | Copper | 5.906" (150.00mm) | 5.910" (150.00mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | - | Polyester | ||
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t-Global Technology |
6
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3 dias |
-
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MOQ: 1 MPQ: 1
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IR HEAT SPREADER/EMITTER W/ADH
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PH3 | Heat Spreader | Copper | 11.800" (299.72mm) | 11.811" (300.00mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | - | Polyester | ||
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t-Global Technology |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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PH3N 100X100X0.07MM W/ADH
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PH3n | Heat Spreader | Copper | 3.937" (100.00mm) | 3.937" (100.00mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | - | Polyester | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Aluminum | 0.790" (20.07mm) | 0.790" (20.07mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.155" (3.94mm) | 1.0W @ 40°C | 20.00°C/W @ 200 LFM | - | Black Anodized | ||
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Delta Electronics |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK ASSY INTEL LGA1366
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- | Board Level | Aluminum | 3.543" (90.00mm) | 3.543" (90.00mm) | Bolt On | LGA | 1.004" (25.50mm) | - | - | 0.27°C/W | - | ||
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Wakefield-Vette |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 CLIP-ON BLK
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243 | Board Level | Aluminum | 0.800" (20.32mm) | 0.270" (6.86mm) | Clip | TO-220 | 0.800" (20.32mm) | 2.0W @ 78°C | 8.20°C/W @ 400 LFM | 39.00°C/W | Pre-Black Anodized |
