- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
24,857
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 24-PIN DIP GLUE-ON BLK
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1.250" (31.75mm) | 0.530" (13.46mm) | Thermal Tape, Adhesive (Not Included) | 0.190" (4.83mm) | 1.0W @ 40°C | 15.00°C/W @ 500 LFM | 34.00°C/W | ||
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ASSMANN WSW Components |
317
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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1.299" (32.99mm) | 0.748" (19.00mm) | Press Fit | 0.189" (4.80mm) | - | - | 48.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK 24-DIP BLK ANODIZED
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1.460" (37.08mm) | 1.008" (25.60mm) | Press Fit, Slide On | 0.580" (14.73mm) | 1.0W @ 20°C | 6.00°C/W @ 400 LFM | 20.00°C/W |
