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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
1,757
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK TO-220 TAB/CLIP-ON
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- | Board Level, Vertical | Rectangular, Fins | 1.380" (35.05mm) | Clip and PC Pin | TO-220 | 0.787" (19.99mm) | 2.0W @ 20°C | 6.00°C/W @ 300 LFM | 11.10°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
355
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TAB/CLIP-ON
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- | Board Level, Vertical | Rectangular, Fins | 0.790" (20.07mm) | Clip and PC Pin | TO-220 | 0.787" (19.99mm) | 1.0W @ 20°C | 6.00°C/W @ 400 LFM | 13.10°C/W | ||
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Advanced Thermal Solutions Inc. |
94
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 28MM X 45MM X 11MM
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maxiGRIP | Top Mount | Rectangular, Angled Fins | 1.772" (45.00mm) | Clip | Flip Chip Processors | 0.433" (11.00mm) | - | 4.50°C/W @ 200 LFM | - |
