- Shape：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 6
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
4,893
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 TAB FOLD 25.4MM
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Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | Bolt On and PC Pin | TO-220 | 0.375" (9.52mm) | 3.0W @ 40°C | 8.00°C/W @ 100 LFM | 11.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Rectangular, Fins | 1.000" (25.40mm) | Bolt On | TO-220 | 0.375" (9.52mm) | 3.0W @ 40°C | 8.00°C/W @ 100 LFM | 11.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Rhombus | 1.550" (39.37mm) | Bolt On | TO-3 | 1.225" (31.12mm) | 5.0W @ 30°C | 3.00°C/W @ 200 LFM | 5.40°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Rhombus | 1.550" (39.37mm) | Bolt On | TO-3 | 1.750" (44.45mm) | 10.0W @ 50°C | 2.00°C/W @ 400 LFM | 4.50°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Rhombus | 1.550" (39.37mm) | Bolt On | TO-3 | 1.500" (38.10mm) | 6.0W @ 30°C | 2.00°C/W @ 400 LFM | 4.80°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Rhombus | 1.550" (39.37mm) | Bolt On | TO-3 | 2.000" (50.80mm) | 5.0W @ 30°C | 3.00°C/W @ 200 LFM | 4.20°C/W |
