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- Shape:
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- Length:
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- Width:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Thermal Resistance @ Forced Air Flow:
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- Condiciones seleccionadas:
Descubre los productos 108,637
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | ||
Advanced Thermal Solutions Inc. |
1,207
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X6MM XCUT CP
|
pushPIN | Square, Fins | 1.969" (50.00mm) | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.236" (6.00mm) | 15.83°C/W @ 100 LFM | ||||
Advanced Thermal Solutions Inc. |
975
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 7.5MM
|
maxiFLOW | Square, Angled Fins | 0.590" (14.99mm) | 0.590" (14.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.295" (7.50mm) | 19.70°C/W @ 200 LFM | ||||
Advanced Thermal Solutions Inc. |
222
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 7.5MM
|
maxiFLOW | Square, Angled Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.295" (7.50mm) | 8.60°C/W @ 200 LFM | ||||
Advanced Thermal Solutions Inc. |
1,137
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 37.5 X 37.5 X 7.5MM
|
maxiFLOW | Square, Angled Fins | 1.476" (37.50mm) | 1.476" (37.50mm) | Thermal Tape, Adhesive (Included) | BGA | 0.295" (7.50mm) | 4.90°C/W @ 200 LFM | ||||
Advanced Thermal Solutions Inc. |
712
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 17.5MM
|
maxiFLOW | Square, Angled Fins | 0.590" (14.99mm) | 0.590" (14.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.689" (17.50mm) | 8.70°C/W @ 200 LFM | ||||
Advanced Thermal Solutions Inc. |
1,018
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 23MM X 23MM X 17.5MM
|
maxiFLOW | Square, Angled Fins | 0.900" (23.00mm) | 0.906" (23.01mm) | Thermal Tape, Adhesive (Included) | BGA | 0.689" (17.50mm) | 5.10°C/W @ 200 LFM | ||||
Advanced Thermal Solutions Inc. |
745
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25.2MM X 25.2MM X 4MM
|
blueICE | Square, Angled Fins | 0.992" (25.20mm) | 0.992" (25.20mm) | Thermal Tape, Adhesive (Included) | BGA | 0.157" (4.00mm) | 14.80°C/W @ 200 LFM | ||||
Advanced Thermal Solutions Inc. |
306
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 70X70X25MM XCUT CP
|
pushPIN | Square, Fins | 2.756" (70.00mm) | 2.756" (70.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | 2.18°C/W @ 100 LFM | ||||
Advanced Thermal Solutions Inc. |
394
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 45MM X 45MM X 17.5MM
|
maxiFLOW | Square, Angled Fins | 1.772" (45.00mm) | 1.772" (45.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.689" (17.50mm) | 1.60°C/W @ 200 LFM | ||||
Advanced Thermal Solutions Inc. |
302
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 12.5MM
|
maxiGRIP, maxiFLOW | Square, Angled Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | Clip, Thermal Material | BGA | 0.492" (12.50mm) | 3.00°C/W @ 200 LFM | ||||
Advanced Thermal Solutions Inc. |
1,290
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 35X35X12.5MM
|
maxiFLOW, superGRIP | Square, Angled Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | Clip, Thermal Material | BGA | 0.492" (12.50mm) | 3.00°C/W @ 200 LFM | ||||
Advanced Thermal Solutions Inc. |
1,151
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X10MM L-TAB CP
|
pushPIN | Square, Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 18.36°C/W @ 100 LFM | ||||
Advanced Thermal Solutions Inc. |
163
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X25MM XCUT FP
|
pushPIN | Square, Fins | 1.969" (50.00mm) | 1.969" (50.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | 7.44°C/W @ 100 LFM | ||||
Advanced Thermal Solutions Inc. |
4,145
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 17MM X 17MM X 7.5MM
|
maxiFLOW | Square, Angled Fins | 0.669" (17.00mm) | 0.669" (17.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.295" (7.50mm) | 18.20°C/W @ 200 LFM | ||||
Advanced Thermal Solutions Inc. |
212
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 7.5MM
|
maxiFLOW | Square, Angled Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.295" (7.50mm) | 11.90°C/W @ 200 LFM | ||||
Advanced Thermal Solutions Inc. |
205
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 23MM X 23MM X 7.5MM
|
maxiFLOW | Square, Angled Fins | 0.900" (23.00mm) | 0.906" (23.01mm) | Thermal Tape, Adhesive (Included) | BGA | 0.295" (7.50mm) | 10.90°C/W @ 200 LFM | ||||
Advanced Thermal Solutions Inc. |
209
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X25MM XCUT CP
|
pushPIN | Square, Fins | 2.362" (60.00mm) | 2.362" (60.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | 2.66°C/W @ 100 LFM | ||||
Advanced Thermal Solutions Inc. |
440
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 7.5MM
|
maxiFLOW | Square, Angled Fins | 1.220" (30.99mm) | 1.220" (30.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.295" (7.50mm) | 6.90°C/W @ 200 LFM | ||||
Advanced Thermal Solutions Inc. |
115
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 12.5MM
|
maxiFLOW | Square, Angled Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.492" (12.50mm) | 10.20°C/W @ 200 LFM | ||||
Advanced Thermal Solutions Inc. |
116
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 27MM X 27MM X 12.5MM
|
maxiFLOW | Square, Angled Fins | 1.063" (27.00mm) | 1.063" (27.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.492" (12.50mm) | 4.80°C/W @ 200 LFM |