- Material：
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- Length：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 18
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
12,250
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK D2PAK .4" HIGH SMD
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- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
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- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | Tin | ||
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|
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Aavid, Thermal Division of Boyd Corporation |
16,283
|
3 dias |
-
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MOQ: 1 MPQ: 1
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TOP MOUNT HEATSINK .4" D2PAK
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- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | Tin | ||
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Ohmite |
1,270
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK BLACK ANODIZED
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CSM | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.472" (12.00mm) | 0.492" (12.50mm) | - | Solderable Feet | TO-220 | 1.228" (31.20mm) | 2.0W @ 44°C | - | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
2,297
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-263 COPPER
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- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | - | - | TO-263 (D2Pak) | 0.402" (10.21mm) | - | 9.50°C/W @ 200 LFM | Tin | |||
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ASSMANN WSW Components |
1,035
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Square, Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | Clip and Board Mounts | TO-220 | 0.335" (8.50mm) | - | - | Tin | ||
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Wakefield-Vette |
1,546
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR STUD MT DIODE BLACK
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695 | Board Level | Aluminum | - | - | - | 0.625" (15.88mm) ID, 1.330" (33.78mm) OD | Bolt On | Stud Mounted Diode | 0.530" (13.46mm) | 4.0W @ 72°C | 5.20°C/W @ 400 LFM | Black Anodized | ||
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ASSMANN WSW Components |
1,935
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ANOD ALUM SOT-32/TO-220
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.189" (30.20mm) | 1.000" (25.40mm) | - | Bolt On and Board Mounts | SOT-32, TO-220 | 0.315" (8.00mm) | - | - | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
2,750
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-263 COPPER
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- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | - | - | TO-263 (D2Pak) | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | Tin | |||
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Advanced Thermal Solutions Inc. |
2,833
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-263 COPPER
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- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | - | - | TO-263 (D2Pak) | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | Tin | |||
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Advanced Thermal Solutions Inc. |
2,833
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-263 COPPER
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- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | - | - | TO-263 (D2Pak) | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | Tin | |||
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Advanced Thermal Solutions Inc. |
1,490
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/TAB BLACK
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.380" (35.05mm) | 1.000" (25.40mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | - | 13.00°C/W @ 200 LFM | Black Anodized | |||
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ASSMANN WSW Components |
635
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level | Aluminum | Rectangular, Fins | 1.189" (30.20mm) | 1.000" (25.40mm) | - | Bolt On | SOT-32, TO-220 | 0.311" (7.90mm) | - | - | Black Anodized | ||
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ASSMANN WSW Components |
988
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Square, Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | Clip and Board Mounts | TO-220 | 0.335" (8.50mm) | - | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 40°C | 8.00°C/W @ 500 LFM | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 COPPER W/TAB
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- | Board Level, Vertical | Copper | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | Bolt On and Board Mounts | TO-220 | 0.500" (12.70mm) | - | 13.00°C/W @ 200 LFM | Tin | |||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 40°C | 8.00°C/W @ 500 LFM | Tin |
