- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Advanced Thermal Solutions Inc. |
943
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/TAB BLACK
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1.657" (42.10mm) | 2.010" (51.00mm) | 0.728" (18.50mm) | - | 1.80°C/W @ 200 LFM | 6.70°C/W | |||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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1.250" (31.75mm) | 0.875" (22.22mm) | 0.250" (6.35mm) | 1.5W @ 40°C | 10.00°C/W @ 200 LFM | 22.00°C/W |
