- Series:
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- Material:
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- Shape:
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- Length:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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- Condiciones seleccionadas:
Descubre los productos 58
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Advanced Thermal Solutions Inc. |
1,372
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
MAXIGRIP FANSINK 31X31X14.5MM
|
fanSINK, maxiGRIP | Top Mount | Aluminum | Square, Pin Fins | 1.220" (30.99mm) | Clip, Thermal Material | BGA | 0.571" (14.50mm) | - | 2.10°C/W @ 200 LFM | - | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
3,250
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||||
Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||||
Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||||
Advanced Thermal Solutions Inc. |
440
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 7.5MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.220" (30.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.295" (7.50mm) | - | 6.90°C/W @ 200 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
572
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 24.5MM
|
- | Top Mount | Aluminum | Square, Pin Fins | 1.220" (30.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | - | 4.00°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
555
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 31X31X7.5MM
|
maxiFLOW, superGRIP | Top Mount | Aluminum | Square, Angled Fins | 1.220" (30.99mm) | Clip, Thermal Material | BGA | 0.295" (7.50mm) | - | 6.90°C/W @ 200 LFM | - | Blue Anodized | ||||
Ohmite |
1,763
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-268 BLACK
|
D | Top Mount | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | Solderable Feet | TO-268 | 0.400" (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Black Anodized | ||||
Wakefield-Vette |
243
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 31X31X12MM ELLIPTICAL
|
906 | Top Mount | Aluminum | Square, Fins | 1.220" (30.99mm) | Clip | BGA | 0.457" (11.60mm) | - | 3.50°C/W @ 200 LFM | 10.70°C/W | Black Anodized | ||||
Wakefield-Vette |
155
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 31X31X23MM PIN
|
906 | Top Mount | Aluminum | Square, Pin Fins | 1.220" (30.99mm) | Clip | BGA | 0.892" (22.65mm) | - | 2.40°C/W @ 200 LFM | 9.90°C/W | Black Anodized | ||||
Wakefield-Vette |
339
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 31X31X23MM ELLIPTICAL
|
906 | Top Mount | Aluminum | Square, Fins | 1.220" (30.99mm) | Clip | BGA | 0.892" (22.65mm) | - | 2.50°C/W @ 200 LFM | 8.90°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
300
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 17.5MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.220" (30.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.689" (17.50mm) | - | 3.30°C/W @ 200 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
114
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 7.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.220" (30.99mm) | Clip, Thermal Material | BGA | 0.295" (7.50mm) | - | 6.90°C/W @ 200 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
341
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 17.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.220" (30.99mm) | Clip, Thermal Material | BGA | 0.689" (17.50mm) | - | 3.30°C/W @ 200 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
228
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 19.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.220" (30.99mm) | Clip, Thermal Material | BGA | 0.768" (19.50mm) | - | 3.20°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
155
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 9.5MM
|
maxiGRIP | Top Mount | Aluminum | Square, Fins | 1.220" (30.99mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) | - | 12.00°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
160
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 14.5MM
|
maxiGRIP | Top Mount | Aluminum | Square, Fins | 1.220" (30.99mm) | Clip, Thermal Material | BGA | 0.571" (14.50mm) | - | 6.20°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
575
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 9.5MM
|
- | Top Mount | Aluminum | Square, Fins | 1.220" (30.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 12.00°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
1,779
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 9.5MM
|
- | Top Mount | Aluminum | Square, Pin Fins | 1.220" (30.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 13.50°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
202
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 31MM X 31MM X 14.5MM
|
- | Top Mount | Aluminum | Square, Fins | 1.220" (30.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | - | 6.20°C/W @ 200 LFM | - | Black Anodized |