- Material：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 5
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
3,250
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK D-PAK3 TIN PLATED SMD
|
Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | ||
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|
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Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | ||
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Advanced Thermal Solutions Inc. |
970
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 STEEL W/TAB
|
Board Level, Vertical | Steel | Rectangular | 0.787" (20.00mm) | PC Pin | TO-220 | 0.032" (0.80mm) | - | 13.00°C/W @ 200 LFM | 25.00°C/W | |||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Top Mount | - | Rectangular, Fins | 0.500" (12.70mm) | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W |
