Descubre los productos 9
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Length Width Attachment Method Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
501200B00000G
Aavid, Thermal Division of Boyd Corporation
18,047
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK 14-16 DIP BLACK .19"
- 0.250" (6.35mm) 0.731" (18.57mm) Thermal Tape, Adhesive (Not Included) 0.190" (4.83mm) 0.4W @ 30°C 50.00°C/W @ 200 LFM 68.00°C/W
V5618B
ASSMANN WSW Components
1,169
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK ALUM ANOD
- 0.748" (19.00mm) 0.250" (6.35mm) Press Fit 0.189" (4.80mm) - - 46.00°C/W
501100B00000G
Aavid, Thermal Division of Boyd Corporation
13,233
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK 14-DIP/16-DIP
- 0.750" (19.05mm) 0.250" (6.35mm) Thermal Tape, Adhesive (Not Included) 0.190" (4.83mm) 0.4W @ 30°C 30.00°C/W @ 500 LFM 67.00°C/W
580200B00000G
Aavid, Thermal Division of Boyd Corporation
4,831
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK 14-16 DIP BLK ANODIZED
- 0.890" (22.61mm) 0.600" (15.24mm) Press Fit, Slide On 0.410" (10.42mm) 1.0W @ 20°C 12.00°C/W @ 200 LFM 20.00°C/W
651-B
Wakefield-Vette
4,555
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK 14-16PIN DIP BLK
651 0.750" (19.05mm) 0.415" (10.54mm) Thermal Tape, Adhesive (Not Included) 0.240" (6.10mm) 0.5W @ 40°C 40.00°C/W @ 300 LFM -
V5619A
ASSMANN WSW Components
793
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK ALUM ANOD
- 0.250" (6.35mm) 0.748" (19.00mm) Press Fit 0.190" (4.83mm) - - 48.00°C/W
501000B00000G
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- 0.750" (19.05mm) 0.604" (15.34mm) Thermal Tape, Adhesive (Not Included) 0.212" (5.39mm) 0.6W @ 40°C 60.00°C/W @ 100 LFM 60.00°C/W
560200B00000G
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- 0.890" (22.61mm) 0.600" (15.24mm) Press Fit, Slide On 0.410" (10.42mm) 1.0W @ 20°C 12.00°C/W @ 200 LFM 20.00°C/W
580200W00000G
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- 0.890" (22.61mm) 0.600" (15.24mm) Press Fit and PC Pin 0.410" (10.42mm) 1.0W @ 20°C 12.00°C/W @ 200 LFM 20.00°C/W