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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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ASSMANN WSW Components |
1,169
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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0.748" (19.00mm) | Press Fit | 0.189" (4.80mm) | - | - | 46.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
13,233
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 14-DIP/16-DIP
|
0.750" (19.05mm) | Thermal Tape, Adhesive (Not Included) | 0.190" (4.83mm) | 0.4W @ 30°C | 30.00°C/W @ 500 LFM | 67.00°C/W |
