- Series：
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- Length：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 25
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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t-Global Technology |
5,067
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3 dias |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC BOARD 10X10X2MM
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XL-25 | Heat Spreader | Square | 0.393" (10.00mm) | 0.393" (10.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | ||
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t-Global Technology |
2,715
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3 dias |
-
|
MOQ: 1 MPQ: 1
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XL25 CERAMIC 10X10MM W/LI98C ADH
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XL-25 | Heat Spreader | Square | 0.393" (10.00mm) | 0.393" (10.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.089" (2.25mm) | - | - | ||
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|
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t-Global Technology |
5,198
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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XL25 CERAMIC BOARD 20X20X2MM
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XL-25 | Heat Spreader | Square | 0.787" (20.00mm) | 0.787" (20.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | ||
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t-Global Technology |
4,024
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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XL25 CERAMIC 20X20MM W/LI98C ADH
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XL-25 | Heat Spreader | Square | 0.787" (20.00mm) | 0.787" (20.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.089" (2.25mm) | - | - | ||
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t-Global Technology |
4,065
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CER 12X12X10MM W/TAPE
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- | Heat Spreader | Square, Fins | 0.472" (12.00mm) | 0.472" (12.00mm) | Thermal Tape, Adhesive (Included) | - | 0.394" (10.00mm) | - | - | ||
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t-Global Technology |
1,483
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CER 20X20X6MM W/TAPE
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- | Heat Spreader | Square, Fins | 0.787" (20.00mm) | 0.787" (20.00mm) | Thermal Tape, Adhesive (Included) | - | 0.236" (6.00mm) | - | - | ||
|
|
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t-Global Technology |
367
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK CER 30.5X30.5X6MM W/TAP
|
- | Heat Spreader | Square, Fins | 1.201" (30.50mm) | 1.201" (30.50mm) | Thermal Tape, Adhesive (Included) | - | 0.236" (6.00mm) | - | - | ||
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t-Global Technology |
1,228
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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XL25 CERAMIC 30X30MM W/LI98C ADH
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XL-25 | Heat Spreader | Square | 1.181" (30.00mm) | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.085" (2.15mm) | - | - | ||
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t-Global Technology |
4,410
|
3 dias |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC BOARD 40X40X3MM
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XL-25 | Heat Spreader | Square | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.118" (3.00mm) | - | - | ||
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t-Global Technology |
1,145
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 12X12X10MM
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- | Heat Spreader | Square, Fins | 0.472" (12.00mm) | 0.472" (12.00mm) | - | - | 0.394" (10.00mm) | - | - | ||
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|
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t-Global Technology |
101
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK CER 43X43X6MM
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- | Heat Spreader | Square, Fins | 1.693" (43.00mm) | 1.693" (43.00mm) | - | - | 0.236" (6.00mm) | - | - | ||
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Wakefield-Vette |
543
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK CER TO-220 TO-247
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- | Board Level, Vertical | Rectangular, Fins | 0.803" (20.40mm) | 1.339" (34.00mm) | Solderable Feet | TO-220, TO-247 | 1.512" (38.40mm) | 3.80°C/W @ 200 LFM | 7.00°C/W | ||
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t-Global Technology |
946
|
3 dias |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC 10X10MM W/LI98C ADH
|
XL-25 | Heat Spreader | Square | 0.393" (10.00mm) | 0.393" (10.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.085" (2.15mm) | - | - | ||
|
|
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t-Global Technology |
813
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 20X20X6MM
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- | Heat Spreader | Square, Fins | 0.787" (20.00mm) | 0.787" (20.00mm) | - | - | 0.236" (6.00mm) | - | - | ||
|
|
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t-Global Technology |
264
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 32X32X6MM W/TAPE
|
- | Heat Spreader | Square, Fins | 1.260" (32.00mm) | 1.260" (32.00mm) | Thermal Tape, Adhesive (Included) | - | 0.236" (6.00mm) | - | - | ||
|
|
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t-Global Technology |
53
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 60X60X15MM W/TAPE
|
- | Heat Spreader | Square, Fins | 2.362" (60.00mm) | 2.362" (60.00mm) | Thermal Tape, Adhesive (Included) | - | 0.590" (15.00mm) | - | - | ||
|
|
|
t-Global Technology |
491
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC BOARD 30X30X2MM
|
XL-25 | Heat Spreader | Square | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | ||
|
|
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t-Global Technology |
391
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC 20X20MM W/LI98C ADH
|
XL-25 | Heat Spreader | Square | 0.787" (20.00mm) | 0.787" (20.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.085" (2.15mm) | - | - | ||
|
|
|
t-Global Technology |
266
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC BOARD 40X40X2MM
|
XL-25 | Heat Spreader | Square | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | ||
|
|
|
t-Global Technology |
221
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 30.5X30.5X6MM
|
- | Heat Spreader | Square, Fins | 1.201" (30.50mm) | 1.201" (30.50mm) | - | - | 0.236" (6.00mm) | - | - |
