Fabricante:
Attachment Method:
Package Cooled:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
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La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Shape Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow
HS01
Apex Microtechnology
422
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TOP MT TO-3
Apex Precision Power Rhombus 1.600" (40.64mm) 1.000" (25.40mm) Bolt On TO-3 1.000" (25.40mm) 1.5W @ 20°C 2.00°C/W @ 600 LFM
902-21-2-23-2-B-0
Wakefield-Vette
301
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK 21X21X23MM PIN
902 Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) Clip BGA 0.892" (22.65mm) - 4.30°C/W @ 200 LFM