- Series：
-
- Length：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Condiciones seleccionadas:
Descubre los productos 4
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Wakefield-Vette |
887
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL TO HEATSINK 32X58MM
|
OmniKlip | Board Level, Vertical | Rectangular, Fins | 2.280" (57.90mm) | Clip, Solder Foot | TO-247, TO-264 | 1.823" (46.30mm) | - | - | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Rectangular, Fins | 0.700" (17.78mm) | Bolt On | TO-220 | 0.375" (9.52mm) | 1.0W @ 20°C | 6.00°C/W @ 600 LFM | 20.00°C/W | ||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 12-SIP W/TAB BLACK
|
- | Board Level, Vertical | Rectangular | 1.700" (43.18mm) | Bolt On and PC Pin | 12-SIP | 0.400" (10.16mm) | - | 4.50°C/W @ 200 LFM | 10.00°C/W | |||
|
|
|
CTS Thermal Management Products |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK HORZ .520"H BLACK TO-3
|
7 | Board Level | Rectangular, Fins | 1.530" (38.86mm) | Bolt On | TO-3 | 0.520" (13.21mm) | 6.0W @ 50°C | - | - |
