- Type：
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- Diameter：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 4
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Diameter | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Diameter | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | 0.318" (8.07mm) ID, 0.500" (12.70mm) OD | Press Fit | 0.250" (6.35mm) | 1.0W @ 60°C | 35.00°C/W @ 200 LFM | 60.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | 0.318" (8.07mm) ID, 0.500" (12.70mm) OD | Press Fit | 0.375" (9.52mm) | 1.8W @ 90°C | 30.00°C/W @ 200 LFM | 57.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Top Mount | 0.318" (8.07mm) ID, 0.602" (15.29mm) OD | Bolt On | 0.250" (6.35mm) | 1.6W @ 80°C | 30.00°C/W @ 200 LFM | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Top Mount | 0.318" (8.07mm) ID, 0.750" (19.05mm) OD | Bolt On | 0.437" (11.10mm) | 1.6W @ 60°C | 10.00°C/W @ 600 LFM | - |
