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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
1,468
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-5 1W H=.25"BLK
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Board Level | Cylindrical | - | - | 0.305" (7.75mm) ID, 0.500" (12.70mm) OD | Press Fit | TO-5 | 0.250" (6.35mm) | 35.00°C/W @ 200 LFM | 63.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
953
|
3 dias |
-
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MOQ: 1 MPQ: 1
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TO-5 PUSH-ON HEATSINK 6.35MM
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Board Level | Cylindrical | - | - | 0.318" (8.07mm) ID, 0.500" (12.70mm) OD | Press Fit | TO-5 | 0.250" (6.35mm) | 35.00°C/W @ 200 LFM | 63.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Top Mount | Rectangular, Fins | 0.750" (19.05mm) | 0.604" (15.34mm) | - | Thermal Tape, Adhesive (Not Included) | 14-DIP and 16-DIP | 0.212" (5.39mm) | 60.00°C/W @ 100 LFM | 60.00°C/W |
